Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024

Today, the Intel Foundry Technology Research team announced technology breakthroughs in transistor, interconnects, and packaging technology, among others, which it will unveil in seven of its own papers, along with two more papers in collaboration with industry partners like imec, at the IEEE International Electron Devices Meeting (IEDM) 2024 conference.